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Home > Products > 기능(용도)별 > 구조용 접착

구조용 접착

주성분별 Acrylate Epoxy Silicon Based PU 기타

경화방법 UV 경화 습기(수분) 경화 가열 경화 2액 혼합 기타

기능(용도)별 구조용 접착 Sealing / Encapsulation 열전도성 재료 전기전도성 재료 기타

Product Name

Description

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N-Sil 8551W

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8552HB

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8556F

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8557C

Modified silanes for sealing or bonding electronic components, excellent adhesion to a variety of substrates, no organotin, no low molecular weight cyclic polysiloxanes, excellent impact or vibration resistance

Thermally conductively modified silanes for thermally conductive bonding of electronic components, organotin free, excellent impact or vibration resistance, low contact thermal resistance, reworkable

HM PUR, Used for bonding and sealing a variety of substrates, it has excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, initial cooling and curing, and then curing by moisture

N-PU 5667(HQ)

HM PUR, Used for bonding and sealing a variety of substrates, good chemical and environmental aging resistance, good chemical and environmental aging resistance, initial cooling and curing, followed by moisture curing

PW 2452-1은 아크릴레이트 하이브리드 시스템을 기반으로 하는 일액형, 무용제, UV 가열, 이중 경화 접착제로, 우수한 내습성, 환경 노화, 온도 세척 및 고온 및 저온 사이클링 특성, 플라스틱, 유리, 금속과 같은 다양한 기판에 대한 우수한 접착력, 요변성 특성 및 제어 가능한 유동성을 제공합니다

접착 성능이 우수하고 내진동성 및 내충격성이 우수하며 상온 및 가열에서 이중 경화 방법을 지원하며 열전도율은 1.2W/(m·K)로 UL94-V0 난연 등급을 충족합니다