Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a variety of substrates, no organotin, no low molecular weight cyclic polysiloxanes, excellent impact or vibration resistance

Thermally conductively modified silanes for thermally conductive bonding of electronic components, organotin free, excellent impact or vibration resistance, low contact thermal resistance, reworkable

HM PUR, Used for bonding and sealing a variety of substrates, it has excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, initial cooling and curing, and then curing by moisture

HM PUR, Used for bonding and sealing a variety of substrates, good chemical and environmental aging resistance, good chemical and environmental aging resistance, initial cooling and curing, followed by moisture curing

EW 6356-8, 일액형, 무용제, 열 경화 접착제, 에폭시 시스템, 전도성이 필요한 접지용으로 설계되었습니다. 일반적인 응용 분야에는 CCM/반도체가 포함됩니다.

접착 성능이 우수하고 내진동성 및 내충격성이 우수하며 상온 및 가열에서 이중 경화 방법을 지원하며 열전도율은 1.2W/(m·K)로 UL94-V0 난연 등급을 충족합니다