Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Conductive silica gel, used for conductive bonding, easy to apply glue in a variety of ways, high bonding strength, good reflux resistance, low volume resistivity

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, easy to apply in a variety of ways, fire resistance

Heat-curing epoxy for bonding or potting of electronic components, fast curing, excellent resistance to mechanical shock or vibration, good bending resistance, good flexibility

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping

PW 2452-1은 아크릴레이트 하이브리드 시스템을 기반으로 하는 일액형, 무용제, UV 가열, 이중 경화 접착제로, 우수한 내습성, 환경 노화, 온도 세척 및 고온 및 저온 사이클링 특성, 플라스틱, 유리, 금속과 같은 다양한 기판에 대한 우수한 접착력, 요변성 특성 및 제어 가능한 유동성을 제공합니다