One-component thermosetting conductive silicone CIPG, mainly used for electromagnetic shielding and sealing: suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired

Two-component heat-curing epoxy structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways

One-component heat-curing epoxy structural adhesive for chip corner binding: high reliability

Heat-curing acrylic for sealing, potting and bonding on a variety of materials such as plastics, meets biocompatibility requirements: thixotropic properties and controlled flowability, high SIR, non-sticky surface

Heat-curing acrylic for sealing, potting and bonding of a variety of materials, thixotropic properties and controllable fluidity, non-sticky surface, high SIR, excellent temperature stamping resistance

Heat-curing acrylic for sealing plastics, glass, metals and FR4, as well as protecting sensitive components on PCBs/FPCBs, thixotropic properties and controlled flowability

Heat-curing acrylic for LCD module ITO/COG coating and LED sealing, excellent temperature and impact resistance

UV photothermal curing acrylic for sealing and bonding plastics, glass, metals and FR4, as well as protecting sensitive components on PCBs/FPCBs from mechanical and environmental stress, excellent moisture resistance, environmental aging, temperature punch and high and low temperature cycling performance, low shrinkage and stress during curing, high SIR and low Dk/Df

Ultraviolet photothermal curing acrylic is used for sealing and bonding aluminum on a variety of materials, excellent moisture resistance, environmental aging, temperature punching and high and low temperature cycle performance, high SIR and low Dk/Df, thixotropic performance and controllable fluidity

UV photothermal curable acrylic for glass sealing and bonding to a variety of substrates. Typical applications are lamp component bonding, good fluidity and flexibility, the device can be repeatedly opened and closed, good waterproof performance: IPX7

UV photothermal curing acrylic is used for PC sealing and bonding on a variety of materials, excellent adhesion to a variety of substrates, excellent moisture resistance, environmental aging, temperature punch and high and low temperature cycle performance, low shrinkage and stress during curing

UV photothermal curing acrylic, used for PC sealing and bonding on a variety of materials, good compatibility with flux, excellent moisture resistance, environmental aging, warm punch and high and low temperature cycle performance, low shrinkage and stress during curing

UV photothermal curing acrylic, used for PC sealing and bonding on a variety of materials, good compatibility with flux, excellent moisture resistance, environmental aging, warm punch and high and low temperature cycle performance, low shrinkage and stress during curing

Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability