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Home > Products > 주성분별 > Silicon Based

Silicon Based

주성분별 Acrylate Epoxy Silicon Based PU 기타

경화방법 UV 경화 습기(수분) 경화 가열 경화 2액 혼합 기타

기능(용도)별 구조용 접착 Sealing / Encapsulation 열전도성 재료 전기전도성 재료 기타

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Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8551NT

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8551W

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8552HB

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8556F

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

N-Sil 8557C

Modified silanes for sealing or bonding electronic components, excellent adhesion to a variety of substrates, no organotin, no low molecular weight cyclic polysiloxanes, excellent impact or vibration resistance

Thermally conductively modified silanes for thermally conductive bonding of electronic components, organotin free, excellent impact or vibration resistance, low contact thermal resistance, reworkable

Two-part, solvent free, thermally conductive gap filler, easily repairable and removable, low density, lightweight, low viscosity for easy dispensing, and it is suitable for non-wearing point dispensing systems, high thermal conductivity, >2.0W/(m·K).