Two-component solvent-free acrylic structural adhesive: excellent bond strength, excellent toughness and impact resistance, no flow

Thermally conductive modified silanes for thermally conductive bonding of electronic components: no organotin, excellent impact or vibration resistance, low contact thermal resistance, can be repaired

One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired

Two-component acrylic for structural bonding of a variety of materials such as plastics, metals, ceramics, and wood, low odor, excellent high temperature resistance, fast curing at room temperature, no special surface treatment

Conductive silica gel, used for electromagnetic shielding CIPG, curable at room temperature, excellent electromagnetic shielding performance, excellent sealing

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

CollTech Flyer_Adhesive Solution for Smart speaker_EN