전기전도성 재료

Product Name
Description
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N-Sil 8352
One-component thermosetting conductive silicone CIPG, mainly used for electromagnetic shielding and sealing: suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability
N-Sil 8356
Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability
N-Sil 8352
Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability
N-Sil 8358
Conductive silica gel for electromagnetic shielding CIPG, suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability
N-Sil 8462
Conductive silica gel, used for electromagnetic shielding CIPG, curable at room temperature, excellent electromagnetic shielding performance, excellent sealing
N-Sil 8391
Conductive silica gel, used for conductive bonding, easy to apply glue in a variety of ways, high bonding strength, good reflux resistance, low volume resistivity
N-PU 5103M
UV moisture curing polyurethane coating, for coating, fast UV radiation curing, followed by moisture curing, low odor, excellent adhesion properties for FPC and PCB, excellent electrical properties,
EW 6356-8
EW 6356-8, 일액형, 무용제, 열 경화 접착제, 에폭시 시스템, 전도성이 필요한 접지용으로 설계되었습니다. 일반적인 응용 분야에는 CCM/반도체가 포함됩니다.