Thermally conductive modified silanes for thermally conductive bonding of electronic components: no organotin, excellent impact or vibration resistance, low contact thermal resistance, can be repaired

One-component thermal grease: high thermal conductivity, low modulus and mechanical stress, easy to apply and remove with alcohol or acetone, high temperature resistance

Thermal grease for thermal management of heat sinks, memory and chipsets, power transistor CPUs, etc., suitable thermal conductivity, easy to apply and remove with alcohol or acetone, high temperature resistance, no drying problems, low viscosity

Thermal grease for thermal management of heat sinks, memory and chipsets, power transistor CPUs, etc., suitable thermal conductivity, easy to apply and remove with alcohol or acetone, high temperature resistance, no drying problems, low viscosity

Thermal grease, used for thermal management of heat sinks, memory and chipsets, power transistor CPUs, etc., high thermal conductivity, low modulus and mechanical stress, easy to apply and remove with alcohol or acetone, high temperature resistance

Thermally conductively modified silanes for thermally conductive bonding of electronic components, organotin free, excellent impact or vibration resistance, low contact thermal resistance, reworkable

Two-part, solvent free, thermally conductive gap filler, easily repairable and removable, low density, lightweight, low viscosity for easy dispensing, and it is suitable for non-wearing point dispensing systems, high thermal conductivity, >2.0W/(m·K).

접착 성능이 우수하고 내진동성 및 내충격성이 우수하며 상온 및 가열에서 이중 경화 방법을 지원하며 열전도율은 1.2W/(m·K)로 UL94-V0 난연 등급을 충족합니다