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Home > Products > 주성분별 > Epoxy

Epoxy

주성분별 Acrylate Epoxy Silicon Based PU 기타

경화방법 UV 경화 습기(수분) 경화 가열 경화 2액 혼합 기타

기능(용도)별 구조용 접착 Sealing / Encapsulation 열전도성 재료 전기전도성 재료 기타

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One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired

Two-component heat-curing epoxy structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways

One-component heat-curing epoxy structural adhesive for chip corner binding: high reliability

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, easy to apply in a variety of ways, fire resistance

Heat-curing epoxy for bonding or potting of electronic components, fast curing, excellent resistance to mechanical shock or vibration, good bending resistance, good flexibility

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

EW 6300M4-HV

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping

Two-component epoxy for bonding or reinforcing electronic components, excellent adhesion to a variety of substrates, high thixotropy, long operating time, easy to apply in a variety of ways

Two-component epoxy, used for bonding or reinforcing electronic components, has excellent adhesion to a variety of substrates, optical transparency, low viscosity, good flowability, good waterproofing and aging resistance

Two-component epoxy for bonding or reinforcing electronic components, excellent adhesion to a variety of substrates, high thixotropy, long operating time, easy to apply in a variety of ways

EW 6356-8, 일액형, 무용제, 열 경화 접착제, 에폭시 시스템, 전도성이 필요한 접지용으로 설계되었습니다. 일반적인 응용 분야에는 CCM/반도체가 포함됩니다.