One-component thermosetting conductive silicone CIPG, mainly used for electromagnetic shielding and sealing: suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

Two-component epoxy for bonding or reinforcing electronic components, excellent adhesion to a variety of substrates, high thixotropy, long operating time, easy to apply in a variety of ways

UV moisture curing polyurethane coating, for coating, fast UV radiation curing, followed by moisture curing, low odor, excellent adhesion properties for FPC and PCB, excellent electrical properties,

접착 성능이 우수하고 내진동성 및 내충격성이 우수하며 상온 및 가열에서 이중 경화 방법을 지원하며 열전도율은 1.2W/(m·K)로 UL94-V0 난연 등급을 충족합니다

Typical Solutions