Two-component solvent-free acrylic structural adhesive: low odor, excellent high temperature resistance, fast curing at room temperature, no special surface pretreatment required

Two-component solvent-free acrylic structural adhesive: low odor, excellent high temperature resistance, fast curing at room temperature, no special surface pretreatment required

Two-component solvent-free acrylic structural adhesive: Excellent bond strength, excellent toughness and impact resistance, no flow

Two-component solvent-free acrylic structural adhesive: excellent bond strength, excellent toughness and impact resistance, no flow

UV-curable acrylic for component encapsulation protection: good compatibility with flux, excellent moisture resistance, environmental aging, temperature punching and high and low temperature cycle performance, low shrinkage and stress during curing

Heat-curing acrylic for sealing, potting and bonding on a variety of materials such as plastics, meets biocompatibility requirements: thixotropic properties and controlled flowability, high SIR, non-sticky surface

One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired

Two-component heat-curing epoxy structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways

One-component heat-curing epoxy structural adhesive for chip corner binding: high reliability

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, easy to apply in a variety of ways, fire resistance

Heat-curing epoxy for bonding or potting of electronic components, fast curing, excellent resistance to mechanical shock or vibration, good bending resistance, good flexibility

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, excellent insulation properties, and excellent environmental aging resistance

Thermally conductive modified silanes for thermally conductive bonding of electronic components: no organotin, excellent impact or vibration resistance, low contact thermal resistance, can be repaired

One-component thermosetting conductive silicone CIPG, mainly used for electromagnetic shielding and sealing: suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

One-component thermosetting conductive silicone CIPG, mainly used for electromagnetic shielding and sealing: suitable field operability, excellent adhesion, excellent electromagnetic shielding performance, excellent reliability and long-term stability

One-component thermal grease: high thermal conductivity, low modulus and mechanical stress, easy to apply and remove with alcohol or acetone, high temperature resistance

Room temperature vulcanized silicone sealant for CCM/FPC protection, with 80°C specific process discoloration function for process check, fast curing at room temperature, thixotropic performance and controllable flowability, excellent impact or vibration resistance, color from purple red to white

Room temperature vulcanized silicone sealant for board level sealing, PCB component protection, FPC reinforcement, speaker shell sealing, etc., fast curing at room temperature, excellent adhesion to a variety of substrates, excellent electrical properties, excellent moisture resistance, high temperature and chemical properties

Two-component polyurethane structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways

HM PUR, Used for bonding and sealing a variety of substrates, it has excellent bonding strength on a variety of substrates, good chemical and environmental aging resistance, initial cooling and curing, and then curing by moisture

HM PUR, Used for bonding and sealing a variety of substrates, good chemical and environmental aging resistance, good chemical and environmental aging resistance, initial cooling and curing, followed by moisture curing

UV moisture curing polyurethane coating, for coating, fast UV radiation curing, followed by moisture curing, low odor, excellent adhesion properties for FPC and PCB, excellent electrical properties,

접착 성능이 우수하고 내진동성 및 내충격성이 우수하며 상온 및 가열에서 이중 경화 방법을 지원하며 열전도율은 1.2W/(m·K)로 UL94-V0 난연 등급을 충족합니다