One-component heat-curing epoxy underfill: excellent resistance to mechanical shock or vibration, easy to apply in multiple ways, low viscosity and good flowability, can be repaired

UV-curable acrylic for sealing and bonding glass to a variety of substrates. Typical applications are camera lens and housing bonding, low UV curing energy, excellent bond strength, excellent moisture resistance, and easy application in a variety of ways

UV-curable acrylic for PC sealing and bonding on a variety of materials, excellent bonding strength, excellent moisture resistance, easy to apply in a variety of ways

Heat-curing low fill, used for CSP or BGA solder joint protection underfill, can be reworked, good compatibility with flux, good flow and fast curing, excellent resistance to mechanical stress and warm stamping

Modified silanes, used for sealing or bonding electronic components, have excellent adhesion to a variety of substrates, do not contain organotin, have excellent impact or vibration resistance, and change color from blue to white when heated

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

Modified silanes for sealing or bonding electronic components, excellent adhesion to a wide range of substrates, no organotin, excellent impact or vibration resistance, high initial bond strength

PW 2452-1은 아크릴레이트 하이브리드 시스템을 기반으로 하는 일액형, 무용제, UV 가열, 이중 경화 접착제로, 우수한 내습성, 환경 노화, 온도 세척 및 고온 및 저온 사이클링 특성, 플라스틱, 유리, 금속과 같은 다양한 기판에 대한 우수한 접착력, 요변성 특성 및 제어 가능한 유동성을 제공합니다

EW 6356-8, 일액형, 무용제, 열 경화 접착제, 에폭시 시스템, 전도성이 필요한 접지용으로 설계되었습니다. 일반적인 응용 분야에는 CCM/반도체가 포함됩니다.

Typical Solutions