Two-component polyurethane structural adhesive: excellent adhesion to a variety of substrates, halogen-free, excellent high temperature and humidity reliability, easy to apply in a variety of ways

Conductive silica gel, used for electromagnetic shielding CIPG, curable at room temperature, excellent electromagnetic shielding performance, excellent sealing

Heat-curing epoxy, used for bonding or potting of electronic components, has excellent adhesion to a variety of substrates, excellent mechanical shock or vibration resistance, easy to apply in a variety of ways, fire resistance

UV moisture curing polyurethane coating, for coating, fast UV radiation curing, followed by moisture curing, low odor, excellent adhesion properties for FPC and PCB, excellent electrical properties,

Two-part, solvent free, thermally conductive gap filler, easily repairable and removable, low density, lightweight, low viscosity for easy dispensing, and it is suitable for non-wearing point dispensing systems, high thermal conductivity, >2.0W/(m·K).

접착 성능이 우수하고 내진동성 및 내충격성이 우수하며 상온 및 가열에서 이중 경화 방법을 지원하며 열전도율은 1.2W/(m·K)로 UL94-V0 난연 등급을 충족합니다

CollTech Flyer_NEVs Adhesive Solutions_General_KR